| TYPE | DESCRIPTION |
| Surface Mount | NO |
| Number of Terminals | 240 |
| EU RoHS | Compliant |
| ECCN (US) | 4A994.a |
| Automotive | No |
| PPAP | No |
| Module | DRAM Module |
| Module Density | 8Gbyte |
| Number of Chip per Module | 16 |
| Chip Density (bit) | 4G |
| Data Bus Width (bit) | 64 |
| Max. Access Time (ns) | 0.225 |
| Maximum Clock Rate (MHz) | 1600 |
| Chip Configuration | 512Mx8 |
| Chip Package Type | FBGA |
| Minimum Operating Supply Voltage (V) | 1.425 |
| Typical Operating Supply Voltage (V) | 1.5 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| Operating Current (mA) | 1040 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 |
| Module Sides | Double |
| ECC Support | No |
| Number of Ranks | Dual |
| Number of Chip Banks | 8 |
| CAS Latency | 11 |
| SPD EEPROM Support | Yes |
| Mounting | Socket |
| Package Height | 30 |
| Package Width | 4(Max) |
| Package Length | 133.35 |
| PCB changed | 240 |
| Supplier Package | UDIMM |
| Lead Shape | No Lead |
| Number of Words | 1073741824 words |
| Package Shape | RECTANGULAR |
| Manufacturer | Samsung Semiconductor |
| Part Status | Obsolete |
| Additional Feature | AUTO/SELF REFRESH; WD-MAX |
| Technology | CMOS |
| Terminal Position | DUAL |
| Terminal Form | NO LEAD |
| Number of Functions | 1 |
| Terminal Pitch | 1 mm |
| Reach Compliance Code | compliant |
| Pin Count | 240 |
| JESD-30 Code | R-XDMA-N240 |
| Supply Voltage-Max (Vsup) | 1.575 V |
| Temperature Grade | OTHER |
| Supply Voltage-Min (Vsup) | 1.425 V |
| Number of Ports | 1 |
| Operating Mode | SYNCHRONOUS |
| Organization | 1Gx64 |
| Seated Height-Max | 30.15 mm |
| Memory Width | 64 |
| Memory Density | 68719476736 bit |
| PLL | No |
| Memory IC Type | DDR DRAM MODULE |
| Access Mode | DUAL BANK PAGE BURST |
| Self Refresh | Yes |
| Module Type | 240UDIMM |
| Width | 4 mm |
| Length | 133.35 mm |
