TYPE | DESCRIPTION |
Module | DRAM Module |
Module Density | 4Gbyte |
Number of Chip per Module | 8 |
Chip Density (bit) | 4G |
Data Bus Width (bit) | 64 |
Maximum Clock Rate (MHz) | 1600 |
Chip Configuration | 512Mx8 |
Minimum Operating Supply Voltage (V) | 1.283 |
Typical Operating Supply Voltage (V) | 1.35 |
Maximum Operating Supply Voltage (V) | 1.45 |
Operating Current (mA) | 510 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 95 |
Module Sides | Double |
ECC Support | No |
Number of Ranks | Single |
CAS Latency | 11 |
PC Type | PC3L-12800 |
SPD EEPROM Support | Yes |
Supplier Package | SODIMM |
Mounting | Socket |
Package Height | 30 |
Package Length | 67.6 |
Package Width | 3.5(Max) |
PCB changed | 204 |
Part Status | Active |
Pin Count | 204 |
Organization | 512Mx64 |
PLL | No |
Self Refresh | Yes |
Module Type | 204SODIMM |
RoHS Status | RoHS Compliant |