TYPE | DESCRIPTION |
Surface Mount | YES |
Number of Terminals | 153 |
HTS | 8542.32.00.71 |
Automotive | No |
PPAP | No |
Chip Density (bit) | 1T |
Timing Type | Synchronous |
Interface Type | Serial e-MMC |
Minimum Operating Supply Voltage (V) | 1.7|2.7 |
Typical Operating Supply Voltage (V) | 1.8|3.3 |
Maximum Operating Supply Voltage (V) | 1.95|3.6 |
Package Height | 1 |
Package Width | 11.5 |
Package Length | 13 |
Number of Words | 137438953472 words |
Package Shape | RECTANGULAR |
Manufacturer | Samsung Semiconductor |
Part Status | Unconfirmed |
Type | MLC NAND TYPE |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Number of Functions | 1 |
Terminal Pitch | 0.5 mm |
Reach Compliance Code | compliant |
JESD-30 Code | R-PBGA-B153 |
Supply Voltage-Max (Vsup) | 1.95 V |
Temperature Grade | OTHER |
Supply Voltage-Min (Vsup) | 1.7 V |
Operating Mode | SYNCHRONOUS |
Organization | 128GX8 |
Seated Height-Max | 1.2 mm |
Memory Width | 8 |
Memory Density | 1099511627776 bit |
Parallel/Serial | PARALLEL |
Memory IC Type | FLASH |
Programming Voltage | 1.8 V |
Width | 11.5 mm |
Length | 13 mm |